The byteENGINE AM335x is a high performance industrial oriented computing module. It allows a short time-to-market, while reducing development costs and substantial design risks. The system on module (SOM) uses the Texas Instruments AM335x industrial applications processor family and features a PowerVRTM SGX 3D-Graphics Accelerator Subsystem.

  • ARM® Cortex®-A8 CPU (600 MHz)
  • SDRAM: 256 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • 0 to +75 °C operational temp.

incl. 7,7% VAT

zzgl. Versandkosten

  • ARM® Cortex®-A8 CPU (600 MHz)
  • SDRAM: 256 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • -40 to +85 °C operational temp.

incl. 7,7% VAT

zzgl. Versandkosten

  • ARM® Cortex®-A8 CPU (1000 MHz)
  • 3D graphics acceleration PowerVR™ SGX530
  • SDRAM: 256 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • 0 to +75 °C operational temp.

incl. 7,7% VAT

zzgl. Versandkosten

  • ARM® Cortex®-A8 CPU (800 MHz)
  • Dual core PRU-ICSS (200 MHz)
  • 3D graphics acceleration PowerVR™ SGX530
  • SDRAM: 256 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • -40 to +85 °C operational temp.

incl. 7,7% VAT

zzgl. Versandkosten

  • ARM® Cortex®-A8 CPU (800 MHz)
  • Dual core PRU-ICSS (200 MHz)
  • 3D graphics acceleration PowerVR™ SGX530
  • SDRAM: 256 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • -40 to +85 °C operational temp.

incl. 7,7% VAT

zzgl. Versandkosten

  • ARM® Cortex®-A8 CPU (300/600/800/1000 MHz)
  • Dual core PRU-ICSS (200 MHz)
  • 3D graphics acceleration PowerVR™ SGX530
  • SDRAM: 128 - 512 MB
  • FLASH: eMMC or NAND
  • FLASH: max. 8 GB (eMMC)
  • 30 x 40 x 5 mm
  • -40 to +85 °C operational temp.

incl. 7,7% VAT

zzgl. Versandkosten