bE-AM3359_800_R256_N256_I

Industrielles Computing Modul byteENGINE AM3359 mit ARM® Cortex®-A8-CPU. Die CPU mit 800 MHz bietet zudem Dual-Core-PRUs mit 200 MHz und 3D-Grafikbeschleunigung (Power VR™ SGX530). Die SDRAM-Kapazität beträgt 256 MB DDR3. Die Flash-Speicherkapazität beträgt 256 MB (NAND).

  • ARM® Cortex®-A8 CPU (800 MHz)
  • Dual core PRU-ICSS (200 MHz)
  • 3D-Grafikbeschleunigung PowerVR™ SGX530
  • SDRAM: 256 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • -40 bis +85 °C Betriebstemp.

Das byteENGINE AM3359i ist ein leistungsfähiges Industrial Computing Modul. Es ermöglicht eine kurze time-to-market bei gleichzeitiger Reduzierung der Entwicklungskosten und erheblich reduzierten Designrisiken. 

Das System-on-Module (SOM) verwendet den industriellen Anwendungsprozessor AM3359 von Texas Instruments mit 800 MHz. Darüber hinaus verfügt das SOM über eine PowerVR™ SGX-3D-Grafikbeschleunigung.

Das integrierte SDRAM beträgt 256 MB. Zusätzlich verfügt das Modul über 256 MB NAND.

Die programmierbare Real-Time Unit und das Industrial Communication Subsystem (PRU-ICSS) ermöglichen einen unabhängigen Betrieb des ARM® Cortex®-Prozessors. PRU-ICSS ermöglicht Echtzeitprotokolle wie EtherCAT, PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink und Sercos.

CPU
CPU

AM3359

Frequency (max)

800 MHz

Floating Point

YES (NEON™,SIMD & VFP)

PRU

Dual Core (200 MHz)

Memory
EEPROM

32 KB (containing HW configuration)

Nor-Flash

16 MB (boot medium, eMMC variants only)

SDRAM

256MB

Flash Type

NAND

Ethernet
Speed

2 x 10/100/1.000 (Mbit/s)

Multimedia
2D/3D Graphics

Power VRTM SGX530

Audio

Yes

Touchscreen

Supported

Video

Parallel RGB 24bit

Expansion
SD/MMC/SDIO

3

Serial
SPI

2

I2C

3

UART

6

CAN

2

McASP

2

USB
OTG

2 HS (2.0)

Miscellaneous
Watchdog Timers

1

Boot Mode

Selectable with Strapping Pins on Baseboard

GPIO

4 x 32 GPIOS

GPMC

Yes (Full Pinout)

JTAG

Yes

PWM / ECAP / QEP

3

Serial Console

1

Mechanical Information
Connector

2 x 100 pin

Abmessungen

30 x 40 x 5 mm

Input Voltage

3 – 5 V

Operational Temperature

-40 to +85 °C

Power Consumption

~2 W

Operating System
Linux (yocto)

Yes

Ordering Code: bE-AM335[9]_[800]_R[256 MB]_[N 256MB]_[I]

Mit dem Ordering Code erkennt sehr Kunde sehr einfach die Spezifikationen des SOM.

[SOM]:SOM typebE: byteENGINE
AM335[x]:CPU type2: AM3352, 4: AM3354, 6: AM3356, 8: AM3358, 9: AM3359
[SPEED MHz]:Clock speed300, 600, 800, 1000
R[xxx MB]:RAM size128, 256, 512 MB
[E GB]:eMMC FLASH size[E 4, 8 GB]
[N MB]:NAND FLASH size[N 256 MB]
[C, I]:Temperature range[C] Customer 0° to +70° Celsius,
[I] Industrial -40° to +85° Celsius

 

          

This section describes briefly the advantages of the compatible operating system (OS) Yocto Project. Furthermore, you will find information about how to create a bootable SD-Card with a prebuilt image by bytesatwork, how to install the prebuilt toolchain with an example and delivers links to the provided Yocto-layers.

Table of content

  1. Supported OS
  2. Creating SD-Card
    Download Link (SDCard): https://bytesatwork.ch/downloads/transfer/bytesatwork/devbase-image-bytesatwork-bytepanel.wic.gz
  3. Initial SDK / Toolchain
    Download Link: https://bytesatwork.ch/downloads/transfer/bytesatwork/poky-bytesatwork-glibc-x86_64-devbase-image-bytesatwork-armv7at2hf-neon-bytepanel-toolchain-3.0.1.sh
  4. Yocto Layer
  1. Supported OS

The Yocto Project (YP) is an open source collaboration project that helps developers create custom Linux-based systems regardless of the hardware architecture. Bytes at work is part of the Yocto Project and provides specific solutions for your specific applications. bytesatwork provides furthermore the necessary tools for a quick and productive test run.
Here are some highlights for the Yocto Project:

  • Provides a recent Linux kernel along with a set of system commands and libraries suitable for the embedded environment.
  • Makes available system components such as X11, GTK+, Qt, Clutter, and SDL (among others) so you can create a rich user experience on devices that have display hardware. For devices that do not have a display or where you wish to use alternative UI frameworks, these components need not be installed.
  • Creates a focused and stable core compatible with the OpenEmbedded project with which you can easily and reliably build and develop.
  • Fully supports a wide range of hardware and device emulation through the QEMU Emulator.
  • Provides a layer mechanism that allows you to easily extend the system, make customizations, and keep them organized.
  1. Creating SD-Card

To accelerate the starting process bytesatwork provides a prebuilt image. This allows you to start a complete Yocto System from a microSD-Card. Here you will find information about how to write the prebuilt image to a microSD-Card in order to create a bootable image:

* Windows *
- Unzip the <file.wic.gz> (e.g. with 7-zip)
- Write the resulting <file.wic> to the uSD-card with a tool like Roadkil's Disk Image[https://www.roadkil.net/program.php?ProgramID=12]

* Linux *
- gunzip -c <file.wic.gz> | dd of=/dev/mmcblk0 bs=8M conv=fdatasync status=progress
- To improve write performance, you could use bmap-tools:
  bmaptool copy <file.wic.gz> /dev/mmcblk0
  1. Initial SDK / Toolchain

In the Yocto Project development environment, toolchains are used to build the image and applications that run on the target hardware. You can install a prebuilt toolchain with just a few commands:

1) Download the Toolchain and install it
# sudo ./poky-bytesatwork-glibc-x86_64-devbase-image-bytesatwork-armv7at2hf-neon-bytepanel-toolchain-3.0.1.sh

2) Source the Toolchain
# source /opt/poky-bytesatwork/3.0.1/environment-setup-armv7at2hf-neon-poky-linux-gnueabi

3) Check if Cross-compiler is available in environment:
# echo $CC
# arm-poky-linux-gnueabi-gcc -march=armv7-a -mthumb -mfpu=neon -mfloat-abi=hard --sysroot=/opt/poky-bytesatwork/3.0.1/sysroots/armv7at2hf-neon-poky-linux-gnueabi

4) Crosscompile the source code, e.g. by:
# $CC helloworld.c -o helloworld

5) Check generated binary:
# file helloworld
# helloworld: ELF 32-bit LSB pie executable, ARM, EABI5 version 1

6) Copy the binary to the target, e.g. by scp:
# scp helloworld root@<ip of bytepanel>:

7) Login to target by user root, password rootme:
# ssh root@<ip of bytepanel>

8) Run helloworld on target:
root@bytepanel:~# cd /root; ./helloworld
  1. Yocto Layers

Layers support the inclusion of technologies, hardware components, and software components. bytesatwork provides on GitHub the according layers to build a Yocto Based operating system (OS) efficiently. You can find the layers at the following links:

Generic layer:
Yocto branch zeus: https://github.com/bytesatwork/meta-bytesatwork.git

Platform specific layer:
Yocto branch zeus: https://github.com/bytesatwork/meta-bytesatwork-ti.git

Build your own image by using the repo tool:
Yocto branch zeus, https://github.com/bytesatwork/bsp-platform-ti/
How to use the repo tool: https://github.com/bytesatwork/bsp-platform-ti/blob/zeus/README.md

 

Ähnliche Produkte

bE-AM3354_1000_R256_N256_C

  • ARM® Cortex®-A8 CPU (1000 MHz)
  • 3D-Grafikbeschleunigung PowerVR™ SGX530
  • SDRAM: 256 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • 0 to +75 °C Betriebstemp.
Weiterlesen

bE-AM335x_xxx_Rxxx_Ex or Nx_C,I

  • ARM® Cortex®-A8 CPU (300/600/800/1000 MHz)
  • Dual core PRU-ICSS (200 MHz)
  • 3D Grafik-Beschleuniger PowerVR™ SGX530
  • SDRAM: 128 - 512 MB
  • FLASH: eMMC oder NAND
  • FLASH: max. 8 GB eMMC
  • 30 x 40 x 5 mm
  • -40 bis +85 °C Betriebstemp.
Weiterlesen

bE-AM3352_600_R256_N256_ I

  • ARM® Cortex®-A8 CPU (600 MHz)
  • SDRAM: 256 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • -40 bis +85 °C Betriebstemp.
Weiterlesen

bE-AM3352_600_R256_N256_C

  • ARM® Cortex®-A8 CPU (600 MHz)
  • SDRAM: 256 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • 0 bis +75 °C Betriebstemp.
Weiterlesen

bE-AM3354_1000_R256_N256_C

  • ARM® Cortex®-A8 CPU (1000 MHz)
  • 3D-Grafikbeschleunigung PowerVR™ SGX530
  • SDRAM: 256 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • 0 bis +75 °C Betriebstemp.
Weiterlesen

bE-AM3358_1000_R512_N256_I

  • ARM® Cortex®-A8 CPU (1000 MHz)
  • Dual core PRU-ICSS (200 MHz)
  • 3D-Grafikbeschleunigung PowerVR™ SGX530
  • SDRAM: 512 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • -40 bis +85 °C Betriebstemp.
Weiterlesen

bE-AM3358_800_R256_N256_ I

  • ARM® Cortex®-A8 CPU (800 MHz)
  • Dual core PRU-ICSS (200 MHz)
  • 3D-Grafikbeschleunigung PowerVR™ SGX530
  • SDRAM: 256 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • -40 bis +85 °C Betriebstemp.
Weiterlesen

bE-AM3358_1000_R512_E4_I

  • ARM® Cortex®-A8 CPU (1000 MHz)
  • Dual core PRU-ICSS (200 MHz)
  • 3D-Grafikbeschleunigung PowerVR™ SGX530
  • SDRAM: 512 MB
  • FLASH: 4 GB eMMC
  • 30 x 40 x 5 mm
  • -40 to +85 °C Betriebstemp.
Weiterlesen