• Quad ARM® Cortex®-A9 CPU (4x1,0 GHz)
  • Co-CPU: STM32F446, 32-bit ARM® Cortex®-M4
  • 3D: Vivante™ GC2000
  • SDRAM: 2 GB (DDR3)
  • Flash: 4 GB (eMMC)
  • 82 x 50 mm
  • -40 to +85 °C operational temp.
  • max. Quad ARM® Cortex®-A9 CPU (max. 4x1.4 GHz)
  • Co-CPU: STM32F446, 32-bit ARM® Cortex®-M4
  • 3D: Vivante™ GC2000
  • SDRAM: max. 4 GB (DDR3)
  • Flash: max. 64 GB (eMMC)
  • 82 x 50 mm - SMARC 1.1
  • -40 to +85 °C operational temp.
  • ARM® Cortex®-A8 CPU (600 MHz)
  • SDRAM: 256 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • 0 to +75 °C operational temp.
  • Dual-core ARM® Cortex®-A7 CPU (650 MHz)
  • Co-CPU: 32-bit ARM® Cortex®-M4 (207 Mhz)
  • Parallel RGB/MIPI 24bit up to 1366x768@60 FPS
  • Vivante® - OpenGL® ES 2.0, 26 Mtriangle/s, 133 MP/s
  • SDRAM: 512 MB
  • eMMC: 4 GB
  • 30 x 40 x 5 mm
  • -40 to +85 °C operational temp.
  • Single/Dual-core ARM® Cortex®-A7 (650 MHz)
  • Co-CPU: 32-bit ARM® Cortex®-M4 (207 Mhz)
  • Parallel RGB/MIPI 24bit up to 1366x768@60 FPS
  • Vivante® OpenGL® ES 2.0, 26 Mtriangle/s, 133 MP/s
  • SDRAM: max. 1024 MB
  • eMMC: max. 64 GB
  • 30 x 40 x 5 mm
  • -40 to +85 °C operational temp.
  • ARM® Cortex®-A8 CPU (600 MHz)
  • SDRAM: 256 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • 0 to +75 °C operational temp.
  • ARM® Cortex®-A8 CPU (600 MHz)
  • SDRAM: 256 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • -40 to +85 °C operational temp.
  • ARM® Cortex®-A8 CPU (1000 MHz)
  • 3D graphics acceleration PowerVR™ SGX530
  • SDRAM: 256 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • 0 to +75 °C operational temp.
  • ARM® Cortex®-A8 CPU (1000 MHz)
  • 3D graphics acceleration PowerVR™ SGX530
  • SDRAM: 256 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • 0 to +75 °C operational temp.
  • ARM® Cortex®-A8 CPU (1000 MHz)
  • Dual core PRU-ICSS (200 MHz)
  • 3D graphics acceleration PowerVR™ SGX530
  • SDRAM: 512 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • -40 to +85 °C operational temp.
  • ARM® Cortex®-A8 CPU (1000 MHz)
  • Dual core PRU-ICSS (200 MHz)
  • 3D graphics acceleration PowerVR™ SGX530
  • SDRAM: 512 MB
  • FLASH: 4 GB eMMC
  • 30 x 40 x 5 mm
  • -40 to +85 °C operational temp.
  • ARM® Cortex®-A8 CPU (800 MHz)
  • Dual core PRU-ICSS (200 MHz)
  • 3D graphics acceleration PowerVR™ SGX530
  • SDRAM: 256 MB
  • FLASH: 256 MB NAND
  • 30 x 40 x 5 mm
  • -40 to +85 °C operational temp.