byteENGINE IMX93 OSM
OSM: Open Module Standard for robust, future-proof embedded systems
What is OSM and why is it relevant?
OSM is an open industrial standard for compact, solderable compute modules that outperforms connector-based formats in several ways. With its LGA design, the module is mounted directly on the PCB like a component, which reduces height and footprint, improves signal integrity, and eliminates typical connector weak points under vibration, shock, and temperature fluctuations. In manufacturing, you benefit from a fully SMT process with pick-and-place and reflow, without manual mating steps, which lowers scrap and assembly costs and increases reproducibility in series production. At the same time, the high pin density in a small area enables demanding interfaces in very compact devices. As a standard continuously advanced by industry, OSM offers a clear scaling strategy across four defined sizes and various SoC performance levels, so upgrades usually do not require a complete carrier redesign.
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OSM-Logo
Why bytesatwork relies on OSM
We believe in open standards because they create choice and reduce risks. OSM is continuously developed within the industry and is not tied to a single manufacturer. For production, OSM is a clear advantage: placement by pick-and-place, reflow, no manual connectors. This makes series production reproducible, cost-efficient, and reliable. At the same time, OSM offers high performance in a small footprint, enabling even demanding interfaces in very compact devices.
Our OSM-Modules
- byteENGINE STM32MP25 OSM
Your benefits at a glance
- Compact form factor: Reduced height and footprint with LGA, solder-down mounting.
- Signal integrity: Improved versus connector-based formats.
- Field robustness: No connector weak points under vibration, shock, or temperature swings.
- Manufacturing: Fully SMT-compatible (pick-and-place, reflow), no manual mating steps.
- Cost and yield: Lower scrap and assembly costs; better reproducibility in series manufacturing.
- I/O density: High pin density enables demanding interfaces in very compact devices.
- Scalability: Clear path across four sizes and multiple SoC performance tiers.
- Upgradability: Upgrades typically possible without a complete carrier redesign.
- Openness and roadmap: Industry-driven, continuously evolving open standard.
OSM form factors
| Size | Measurement | Pins up to |
|---|---|---|
| 0 | 30 x 15mm | 188 |
| S | 30 x 30mm | 332 |
| M | 30 x 45mm | 476 |
| L | 45 x 45mm | 662 |
The OSM standard offers module sizes ranging from ultra-compact to high-performance, providing a robust, solderable platform that is scalable and allows upgrades without a complete redesign.
Devkits, Software and Support
With our OSM devkits, you can quickly move from concept to a functional prototype. Hardware and software are coordinated so that your team can immediately test, evaluate functions, and make decisions. Development boards with all the essential interfaces and a prepared software environment ensure you can get started without delays.
While you focus on the application, we support the commissioning process, provide concrete recommendations for production-ready design, and take care of aspects such as thermal management and series maturity. This reduces risk and time to market, and makes the transition to production predictable, including support during ramp-up.