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bE-i.MX6_PlusQ_4x1.0_R2048_E4_I

max. Quad ARM® Cortex®-A9 CPU (max. 4x 1.0 GHz)
Co-CPU: STM32F446, 32-bit ARM® Cortex®-M4
3D: Vivante™ GC2000
SDRAM: max. 4 GB (DDR3)
Flash: max. 64 GB (eMMC)
82 x 50 mm - SMARC 1.1
-40 to +85 °C operational temp.

bE-i.MX6_Plusx_SPEED_Rxxx_Ex_C,I

max. Quad ARM® Cortex®-A9 CPU (max. 4x 1.0 GHz)
Co-CPU: STM32F446, 32-bit ARM® Cortex®-M4
3D: Vivante™ GC2000
SDRAM: max. 4 GB (DDR3)
Flash: max. 64 GB (eMMC)
82 x 50 mm - SMARC 1.1
-40 to +85 °C operational temp.

bE-AM3352_600_R256_N256_C

ARM® Cortex®-A8 CPU (600 MHz)
SDRAM: 256 MB
FLASH: 256 MB NAND
30 x 40 x 5 mm
0 to +75 °C operational temp.
~2 W power consumption

bE-STM32MP157_650_R512_E4_I

Dual-core ARM® Cortex®-A7 CPU (650 MHz)
Co-CPU: 32-bit ARM® Cortex®-M4 (207 Mhz)
Parallel RGB/MIPI 24bit up to 1366x768@60 FPS
Vivante® - OpenGL® ES 2.0, 26 Mtriangle/s, 133 MP/s
SDRAM: 512 MB
eMMC: 4 GB
30 x 40 x 5 mm
-40 to +85 °C operational temp.

bE-STM32MP15x_SPEED_Rxxx_Ex_C,I

Single/Dual-core ARM® Cortex®-A7 (650 MHz)
Co-CPU: 32-bit ARM® Cortex®-M4 (207 Mhz)
Parallel RGB/MIPI 24bit up to 1366x768@60 FPS
Vivante® OpenGL® ES 2.0, 26 Mtriangle/s, 133 MP/s
SDRAM: max. 1024 MB
eMMC: max. 64 GB
30 x 40 x 5 mm
-40 to +85 °C operational temp.

bE-AM3352_600_R256_N256_C

ARM® Cortex®-A8 CPU (600 MHz)
SDRAM: 256 MB
FLASH: 256 MB NAND
30 x 40 x 5 mm
0 to +75 °C operational temp.

bE-AM3352_600_R256_N256_ I

ARM® Cortex®-A8 CPU (600 MHz)
SDRAM: 256 MB
FLASH: 256 MB NAND
30 x 40 x 5 mm
-40 to +85 °C operational temp.

bE-AM3354_1000_R256_N256_C

ARM® Cortex®-A8 CPU (1000 MHz)
3D graphics acceleration PowerVR™ SGX530
SDRAM: 256 MB
FLASH: 256 MB NAND
30 x 40 x 5 mm
0 to +75 °C operational temp.

bE-AM3354_1000_R256_N256_C

ARM® Cortex®-A8 CPU (1000 MHz)
3D graphics acceleration PowerVR™ SGX530
SDRAM: 256 MB
FLASH: 256 MB NAND
30 x 40 x 5 mm
0 to +75 °C operational temp.

bE-AM3358_1000_R512_N256_I

ARM® Cortex®-A8 CPU (1000 MHz)
Dual core PRU-ICSS (200 MHz)
3D graphics acceleration PowerVR™ SGX530
SDRAM: 512 MB
FLASH: 256 MB NAND
30 x 40 x 5 mm
-40 to +85 °C operational temp.

bE-AM3358_1000_R512_E4_I

ARM® Cortex®-A8 CPU (1000 MHz)
Dual core PRU-ICSS (200 MHz)
3D graphics acceleration PowerVR™ SGX530
SDRAM: 512 MB
FLASH: 4 GB eMMC
30 x 40 x 5 mm
-40 to +85 °C operational temp.

bE-AM3358_800_R256_N256_ I

ARM® Cortex®-A8 CPU (800 MHz)
Dual core PRU-ICSS (200 MHz)
3D graphics acceleration PowerVR™ SGX530
SDRAM: 256 MB
FLASH: 256 MB NAND
30 x 40 x 5 mm
-40 to +85 °C operational temp.